What is Helium Polish and who benefits from it
What is new in the Helium Polish?
Versions history
Documentation for Helium Polish releases
 
Advantages for analyzing girdle asymmetry and removing girdle asymmetry
Scanning major and minor symmetry features
Measuring diameter of girdles with a conical shape, "CZ" sample
Photoreal image of Helium Polish 3D model
 
Reports
What is new in the Helium Polish reports?
Reports history

Customizing printing and viewing reports
Customizing export data
Customizing MS Word report templates
Customizing internal text report template
 
Helium Polish Illustrated reports (one page reports)
Reports for semipolished diamonds and arbitrary cuts
Recut reports
 
Helium Polish download

Helium Polish Highlights (PDF)
Helium Polish system manual (PDF)
Helium reports documentation (PDF)
 
FAQ
Cut parameters
Creating and customizing pricelists (PDF)
 
DiamCalc
DiBox
DiBox 2.0
GemAdviser Free Version
Helium IG
Helium Polish
Helium Rough
Helium Tender
M-Box 2.0
M-Box 1.5
M-Box
Oxygen DZ
Oxygen HIG
Oxygen Immersion
Oxygen Inclusion
Oxygen Microscope Server
Oxygen Viewer Free Version
Oxygen XRay Server
Pacor
Pacor Client
Stereo Viewer Free Version
ViBox

PACOR - Advanced Computer technologies for Processing of Rough diamonds
Laser Mapping of Concavities
Scanning major and minor symmetry features
Technology patent "A method and apparatus for locating inclusions in a diamond stone"
Immersion Glass
 
Helium help : Comprehensive list of report parameters
MIC & Girdle to MIC

MIC applicable to:

  • Any cut

Girdle to MIC applicable to:

  • Brilliant

Figure 1. Pavilion and crown views of the diamond with indication of the maximum circle that may be inscribed (MIC) in the girdle outline along with the section of the model in the circle's plane.
There is the calculation of the parameter Girdle to MIC below.

Girdle to MIC

Parameter Girdle to MIC is a value of difference between minimal diameter and diameter of Maximum Inscribed Circle in girdle circle.

There is Girdle to MIC parameter in the Illustrated report for Polished Brilliant in the right side of the page. Girdle to MIC also is shown in the string Measurements after values of diameters and symbol "/" (for the reports for polished brilliant only).

MIC (Maximum Inscribe Circle) is indicated in the plots:

Girdle thickness plot. The value MIC shows the position of Maximum Inscribe Circle in the girdle area.

Diameter variation plot. The value MIC means the diameter of Maximum Inscribe Circle.

Radius variation plot. The value MIC means the radius of Maximum Inscribe Circle. The red line in this plot shows the deviation radius of diamond from MIC.

See the sample of plots at the page Full report for Polished Brilliant.

Comprehensive list of the Helium report parameters:

Measurements are used in different systems and tools:

DiamCalc Brilliant Cut Parameters